1. Polymeric materials for electronics packaging and interconnection :
Author: John H. Lupinski, editor, Robert S. Moore, editor.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging-- Materials, Congresses.,Polymers, Congresses.
Classification :
TK7870
.
P654
1989
2. Polymeric materials for electronics packaging and interconnection
Author: John H. Lupinski, editor, Robert S. Moore, editor
Library: Central Library and Documents Center of Industrial University of Khaje Nasiredin Toosi (Tehran)
Subject: ، Electronic packaging -- Materials -- Congresses,، Polymers -- Congresses
Classification :
TK
7870
.
P654
3. Polymeric materials for electronics packaging and interconnection
Author: John H. Lupinski, editor, Robert S. Moore, editor
Library: Library of College of Science University of Tehran (Tehran)
Subject: Materials -- Congresses ، Electronic packaging,Congresses ، Polymers
Classification :
TK
7870
.
P654
1989
4. #Polymeric materials for electronics packaging and interconnection
Author: #John H. Lupinski, editor, Robert S. Moore, editor
Library: Central Library of Esfehan University of Technology (Esfahan)
Subject: Electronic packaging- Materials- Congresses ،Polymers- Congresses
Classification :
#
TK
،#.
P654
5. Polymeric materials for electronics packaging and interconnection
Author: John H. Lupinski, editor, Robert S. Moore, editor
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Materials - Congresses , Polymers - Congresses
Classification :
TK
7870
.
P654
1988
